Product Information

PCF8570T/F5,518

PCF8570T/F5,518 electronic component of NXP

Datasheet
SRAM RAM 256X8 WI2C LOW PWR -4085

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (TWD)

1000: TWD 41.5318 ea
Line Total: TWD 41531.8

0 - Global Stock
MOQ: 1000  Multiples: 1000
Pack Size: 1000
Availability Price Quantity
0 - Global Stock


Ships to you between Thu. 05 Oct to Wed. 11 Oct

MOQ : 1000
Multiples : 1000
1000 : TWD 41.5318

     
Manufacturer
NXP
Product Category
SRAM
RoHS - XON
Y Icon ROHS
Memory Size
2 kb it
Organization
256 X 8
Access Time
-
Maximum Clock Frequency
100 KHz
Supply Voltage - Max
6 V
Supply Voltage - Min
2.5 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
Smd/Smt
Package / Case
SO - 8
Packaging
Reel
Interface
Serial, 2 - Wire, Spi
Memory Type
Sdr
Type
Synchronous
Brand
Nxp Semiconductors
Maximum Operating Current
200 uA
Factory Pack Quantity :
1000
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INTEGRATED CIRCUITS DATA SHEET PCF8570 256 8-bit static low-voltage RAM 2 with I C-bus interface 1999 Jan 06 Product specication Supersedes data of 1997 Sep 02 File under Integrated Circuits, IC12Philips Semiconductors Product specication 256 8-bit static low-voltage RAM with PCF8570 2 I C-bus interface CONTENTS 1 FEATURES 2 APPLICATIONS 3 GENERAL DESCRIPTION 4 QUICK REFERENCE DATA 5 ORDERING INFORMATION 6 BLOCK DIAGRAM 7 PINNING 2 8 CHARACTERISTICS OF THE I C-BUS 8.1 Bit transfer 8.2 Start and stop conditions 8.3 System configuration 8.4 Acknowledge 2 8.5 I C-bus protocol 9 LIMITING VALUES 10 HANDLING 11 DC CHARACTERISTICS 12 AC CHARACTERISTICS 13 APPLICATION INFORMATION 13.1 Application example 13.2 Slave address 13.3 Power-saving mode 14 PACKAGE OUTLINES 15 SOLDERING 15.1 Introduction 15.2 Through-hole mount packages 15.2.1 Soldering by dipping or by solder wave 15.2.2 Manual soldering 15.3 Surface mount packages 15.3.1 Reflow soldering 15.3.2 Wave soldering 15.3.3 Manual soldering 15.4 Suitability of IC packages for wave, reflow and dipping soldering methods 16 DEFINITIONS 17 LIFE SUPPORT APPLICATIONS 2 18 PURCHASE OF PHILIPS I C COMPONENTS 1999 Jan 06 2

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI